Short for micro–Flip Chip Pin Grid Array
, micro-FCPGA is one of two Mobile Pentium III Processor-M packages (the other is micro-FCBGA
). The micro-FCPGA package is a die facedown on an organic substrate. An epoxy material surrounds the die, forming a smooth fillet. The package uses 478 pins
that are 2.03 mm long and .32 mm in diameter and has capacitors on the bottom.
Contrast with micro-FCPGA.