Short for micro–Flip Chip Ball Grid Array, micro-FCBGA is one of two Mobile Pentium III Processor-M packages (the other is micro-FCPGA). The micro-FCBGA package is for surface-mount boards and consists of a die facedown on an organic substrate. An epoxy material surrounds the die, forming a smooth fillet. Where the micro-FCPGA uses pins, this package uses small balls as the contact for the processor. The package uses 479 balls that are .78 mm in diameter and includes capacitors on the top.
Contrast with micro-FCPGA.
