Short for micro–Flip Chip Ball Grid Array
, micro-FCBGA is one of two Mobile Pentium III
Processor-M packages (the other is micro-FCPGA
). The micro-FCBGA package is for surface-mount boards and consists of a die facedown on an organic substrate. An epoxy material surrounds the die, forming a smooth fillet. Where the micro-FCPGA uses pins
, this package uses small balls as the contact for the processor
. The package uses 479 balls that are .78 mm in diameter and includes capacitors on the top.
Contrast with micro-FCPGA.