BGA

Short for ball grid array, a surface-mount integrated circuit package in which the die is attached to the printed circuit board with either plastic or ceramic solder balls instead of metal leads that are used in other packaging. BGA is similar to PGA packaging, but the pins are replaced with balls of solder to allow more contact points between the die and the circuit board. BGAs have better electrical and thermal performance and occupy less space than leaded packages. A disadvantage of BGAs is that they do not have the flexibility that a leaded package has under extreme temperatures and mechanical stress, which means that the solder joints can crack under certain conditions such as applications in the aerospace industry.

Top Articles

Huge List Of Texting and Online Chat Abbreviations

From A3 to ZZZ we list 1,559 text message and online chat abbreviations to help you translate and understand today's texting lingo. Includes Top...

How To Create A Desktop Shortcut To A Website

This Webopedia guide will show you how to create a desktop shortcut to a website using Firefox, Chrome or Internet Explorer (IE). Creating a desktop...

The History Of Windows Operating Systems

Microsoft Windows is a family of operating systems. We look at the history of Microsoft's Windows operating systems (Windows OS) from 1985 to present...

Hotmail [Outlook] Email Accounts

  By Vangie Beal Hotmail is one of the first public webmail services that can be accessed from any web browser. Prior to Hotmail and its...

Legacy Code Definition &...

Legacy code refers to source code that has been inherited from a previous...

Unregulated Power Supply Definition...

An unregulated power supply is a system that transforms input voltage into direct...

Cybersecurity Awareness Training Definition...

Cybersecurity awareness training informs employees of the attack surfaces and vectors in their...