Short for Plastic Small Outline Package, it’s a surface-mount memory packaging from Intel. key features of the PSOP include the following: JEDEC standard compliance, footprint and height 50 percent of DIP, two-side leaded for routing simplicity, 50 mil (1.27 mm) pitch for SMT simplicity and ease of use, gull wing formed leads, and it supports future flash density and feature growth. Intel’s PSOP is JEDEC standard.
See also Small Outline Package.
