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    Short for Thin Small Outline Package, it’s a surface-mount memory packaging from Intel. Features of the TSOP include the following: JEDEC and EIAJ standard dimensions, it’s the smallest leaded package form factor for flash, 0.5 mm (19.7 mil) lead pitch, reduced total package height, 1.20 mm maximum, gull wing formed leads, and supports future flash density and feature growth. Intel’s TSOP package is offered in 32-lead, 40-lead, 48-lead and 56-lead versions in JEDEC and EIAJ registered standard dimensions.

    See also Small Outline Package.