Short for Shrink Small Outline Package, it’s a surface-mount memory packaging from Intel. Key features of the SSOP include the following: JEDEC standard compliance, direction for Intel s higher-density flash architectures, 0.8 mm (31.5 mil) lead pitch offers handling characteristics similar to 50 mil pitch packages, performance in wide temperature applications, and a two-sided and gull wing lead package design. Intel’s SSOP is JEDEC standard.
See also Small Outline Package.
