As with Broadwell, Intel Skylake utilizes a 14nm (nanometer) die shrink fabrication process, and it serves as the “tock” in Intel’s alternating tick-tock model of releasing new processor families. The “tick” to Intel Skylake, codenamed Cannonlake, is expected to be fabricated on a 10nm die shrink.
Intel Skylake Set to Introduce a Wire-Free Computing Environment
In addition to delivering significant increases in performance, battery life and power efficiency, Intel Skylake processors will offer new wireless charging and data transfer capabilities for a wire-free computing environment. Skylake processors are expected to go into production in the second half of 2015, with Skylake systems available for purchase before the end of 2015.
Skylake will leverage the WiGig and WiDi wireless technologies to deliver faster speeds than the Wi-Fi 802.11ac standard while also enabling computers to automatically work wirelessly with monitors and other peripherals. Intel Skylake systems will also be able to wirelessly charge via the Rezence standard, which is being developed by the Alliance for Wireless Power (A4WP).
Intel is also looking to eliminate the need for passwords with Intel Skylake processors by delivering new capabilities for face recognition and other biometric technologies.