TSOPShort for Thin Small Outline Package, it's a surface-mount memory packaging from Intel. Features of the TSOP include the following: JEDEC and EIAJ standard dimensions, it's the smallest leaded package form factor for flash, 0.5 mm (19.7 mil) lead pitch, reduced total package height, 1.20 mm maximum, gull wing formed leads, and supports future flash density and feature growth. Intel's TSOP package is offered in 32-lead, 40-lead, 48-lead and 56-lead versions in JEDEC and EIAJ registered standard dimensions.
See also Small Outline Package.
Stay up to date on the latest developments in Internet terminology with a free weekly newsletter from Webopedia. Join to subscribe now.
Webopedia's student apps roundup will help you to better organize your class schedule and stay on top of assignments and homework. Read More »List of Free Shorten URL Services
A URL shortener is a way to make a long Web address shorter. Try this list of free services. Read More »Top 10 Tech Terms of 2015
The most popular Webopedia definitions of 2015. Read More »
The Open System Interconnection (OSI) model defines a networking framework to implement protocols in seven layers. Use this handy guide to compare... Read More »Computer Architecture Study Guide
This Webopedia study guide describes the different parts of a computer system and their relations. Read More »What Are Network Topologies?
Network Topology refers to layout of a network. How different nodes in a network are connected to each other and how they communicate is... Read More »