Webopedia on Google+Webopedia on TwitterWebopedia on FacebookTech Bytes Blog
Main » TERM » P »


Short for Plastic Small Outline Package, it's a surface-mount memory packaging from Intel. key features of the PSOP include the following: JEDEC standard compliance, footprint and height 50 percent of DIP, two-side leaded for routing simplicity, 50 mil (1.27 mm) pitch for SMT simplicity and ease of use, gull wing formed leads, and it supports future flash density and feature growth. Intel's PSOP is JEDEC standard.

See also Small Outline Package.

The Problem with Statistics

We look at a few of the more troubling aspects of statistics and how these may be used to advance an agenda or skew the facts to someone's... Read More »

29 Free Android Apps for Cash-Strapped Students

From wacky alarm clocks to lecture hall tools and after class entertainment, these Android apps are a good fit for a student's life and budget. Read More »

Sharing Threat Intelligence

A growing number of startups make the sharing of threat intelligence a key part of their solutions. Read More »

The 7 Layers of the OSI Model

The Open System Interconnection (OSI) model defines a networking framework to implement protocols in seven layers. Use this handy guide to compare... Read More »

Network Fundamentals Study Guide

Networking fundamentals teaches the building blocks of modern network design. Learn different types of networks, concepts, architecture and... Read More »

Computer Architecture Study Guide

This Webopedia  study guide describes the different parts of a computer system and their relations. Read More »