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Short for micro-Flip Chip Pin Grid Array, micro-FCPGA is one of two Mobile Pentium III Processor-M packages (the other is micro-FCBGA). The micro-FCPGA package is a die facedown on an organic substrate. An epoxy material surrounds the die, forming a smooth fillet. The package uses 478 pins that are 2.03 mm long and .32 mm in diameter and has capacitors on the bottom.

Contrast with micro-FCPGA.

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