Webopedia on Google+Webopedia on TwitterWebopedia on FacebookTech Bytes Blog
Main » TERM » F »


Acronym for flip chip pin grid array. FC-PGA packages use chips that have been turned upside down and attached to the package or the board using solder balls instead of perimeter bonding wires. The solder balls are jointed directly to a set of solder balls on the substrate (the base layer of the chip and the electrical ground for the circuit). The exposed core rests on the actual package, and the chips make direct contact with the heat sink. This allows for more efficient cooling to take place. Since the chips are placed directly on the board, FC-PGA packages have a high I/O density and shorter electrical connections than other types of packaging. Compare to PPGA and PGA.

29 Free Android Apps for Cash-Strapped Students

From wacky alarm clocks to lecture hall tools and after class entertainment, these Android apps are a good fit for a student's life and budget. Read More »

Sharing Threat Intelligence

A growing number of startups make the sharing of threat intelligence a key part of their solutions. Read More »

Smiley Faces and Symbols

A text smiley face is used to convey a facial expression or emotion in texting and online chat conversations. This Webopedia guide shows you how... Read More »

The 7 Layers of the OSI Model

The Open System Interconnection (OSI) model defines a networking framework to implement protocols in seven layers. Use this handy guide to compare... Read More »

Network Fundamentals Study Guide

Networking fundamentals teaches the building blocks of modern network design. Learn different types of networks, concepts, architecture and... Read More »

Computer Architecture Study Guide

This Webopedia  study guide describes the different parts of a computer system and their relations. Read More »