Short for
ball grid array, a surface-mount
integrated circuit package in which the
die is attached to the
printed circuit board with either plastic or ceramic solder balls instead of metal leads that are used in other packaging. BGA is similar to
PGA packaging, but the pins are replaced with balls of solder to allow more contact points between the die and the circuit board. BGAs have better electrical and thermal performance and occupy less space than leaded packages. A disadvantage of BGAs is that they do not have the flexibility that a leaded package has under extreme temperatures and mechanical stress, which means that the solder joints can crack under certain conditions such as applications in the aerospace industry.
