Click here

BGA

Short for ball grid array, a surface-mount integrated circuit package in which the die is attached to the printed circuit board with either plastic or ceramic solder balls instead of metal leads that are used in other packaging. BGA is similar to PGA packaging, but the pins are replaced with balls of solder to allow more contact points between the die and the circuit board. BGAs have better electrical and thermal performance and occupy less space than leaded packages. A disadvantage of BGAs is that they do not have the flexibility that a leaded package has under extreme temperatures and mechanical stress, which means that the solder joints can crack under certain conditions such as applications in the aerospace industry.



Top Terms
  • 1

    enterprise application

    An enterprise application is the term used to describe applications -- or software -- that a business would use to assist the organization in...

    Read more »

  • 2

    open source

    Generically, open source refers to a program in which the source code is available to the general public for use and/or modification from its...

    Read more »

  • Click Here!

Connect with Webopedia

Did You Know? Archive »

  • Quick Reference Archive »