BGAShort for ball grid array, a surface-mount integrated circuit package in which the die is attached to the printed circuit board with either plastic or ceramic solder balls instead of metal leads that are used in other packaging. BGA is similar to PGA packaging, but the pins are replaced with balls of solder to allow more contact points between the die and the circuit board. BGAs have better electrical and thermal performance and occupy less space than leaded packages. A disadvantage of BGAs is that they do not have the flexibility that a leaded package has under extreme temperatures and mechanical stress, which means that the solder joints can crack under certain conditions such as applications in the aerospace industry.
The following compilation of small business marketing tips highlights some of the expert advice published over at Small Business Computing. Read More »Taking Ownership through Digital Governance
Taking ownership of our own misjudgments or simple forgetfulness takes a healthy amount of humility and some honest self-assessment. Yet sometimes... Read More »Have We Become a World of Addicts?
It's hard to imagine our lives without smartphones. But people who suffer separation anxiety when they don't have their phones nearby may be in... Read More »
With cost and security in mind, we look at five cloud storage options that will suit the needs of most home and SMB owners. Read More »Windows 10 Tips for Desktop PC
Five basic tips to help you customize Windows 10 on your desktop PC. Read More »29 Free Android Apps for Cash-Strapped Students
From wacky alarm clocks to lecture hall tools and after class entertainment, these Android apps are a good fit for a student's life and budget. Read More »
Stay up to date on the latest developments in Internet terminology with a free weekly newsletter from Webopedia. Join to subscribe now.
- Watch Datamation's editor James Maguire moderate roundtable discussions with tech experts from companies such as Accenture, Dell, Blue Jeans Network, Microsoft and more »