Webopedia on Google+Webopedia on TwitterWebopedia on FacebookTech Bytes Blog
Main » TERM » B »

BGA

Short for ball grid array, a surface-mount integrated circuit package in which the die is attached to the printed circuit board with either plastic or ceramic solder balls instead of metal leads that are used in other packaging. BGA is similar to PGA packaging, but the pins are replaced with balls of solder to allow more contact points between the die and the circuit board. BGAs have better electrical and thermal performance and occupy less space than leaded packages. A disadvantage of BGAs is that they do not have the flexibility that a leaded package has under extreme temperatures and mechanical stress, which means that the solder joints can crack under certain conditions such as applications in the aerospace industry.






TECH RESOURCES FROM OUR PARTNERS
DID YOU KNOW?
It's Happening Now: Perceptual Computing is Real

Perceptual computing is the ability for a computer to recognize what is going on around it. More specifically, the computer can perceive the... Read More »

Apple Pay Promises to Strengthen Payment Security

Experts believe that Apple Pay and other competitive payment systems will be far more secure than cards, even cards equipped with EMV chips. Read More »

The Great Data Storage Debate: Is Tape Dead?

Tape clearly is on the decline. But remember, legacy systems can hang for a shockingly long time. Read More »

QUICK REFERENCE
Network Fundamentals Study Guide

A network is a group of two or more computer systems or devices, linked together to share resources, exchange files and electronic communications.... Read More »

Computer Architecture Study Guide

This Webopedia  study guide describes the different parts of a computer system and their relations. Read More »

Webopedia Polls

The trend for the past two years has been for shoppers to spend more online during the holiday season. How do you typically shop for holiday... Read More »