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90 nanometer

90 nanometer is the buzzword of choice (2000-2004) for an advanced semiconductor manufacturing process that combines higher-performance, lower-power transistors, strained silicon, high-speed copper interconnects and low-k dielectric material. Some of the new technologies in 90 nm are strained silicon which causes one type of transistor to switch faster, low-power transistors which are only 50 nm in size, and seven layers of copper interconnects which provide a cost-effective improvement in logic density. The low-k insulator between each of the copper interconnect layers reduces wire to wire capacitance.






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